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Orbital Welding of Semiconductor Process Gas Lines By Barbara K. Henon, Ph.D. January/February 2010
A discussion of the advances in semiconductor welding that meet standards and contribute to better, cleaner, and more repeatable welds
Introduction
Beneath the floor of every microchip manufacturer there is a basement or “subfab” with miles of stainless steel tubing transporting gases used in production. Some of these gases are highly toxic at very low concentrations, some are pyrophoric, bursting into flames on contact with air, and some are highly corrosive. Not only must the piping be corrosion resistant and leak free, but the joining technology must maintain the integrity and corrosion resistance of the system. Furthermore, gases at the parts per billion purity range must be able to pass through the piping systems without accumulating particulates, moisture or other contaminates.
